EDAPS

EPS




EDAPS 2018 Committees

General Co-Chairs
  • Rohit Sharma, Indian Institute of Technology Ropar, India
  • Raj Kumar Nagpal, Synopsys, Inc, India
  • Rakesh Malik, Vervesemi, India

Technical Co-Chairs
  • Jose Schutt-Aine, University of Illinois, USA
  • Jai Narayan Tripathi, ST Microelectronics, India

Advisory Chair
  • Madhavan Swaminathan, GATECH, USA

Publication Co-Chairs
  • Suresh V Subramanyam, Intel, India
  • SLN Murthy, Wuerth Electroniks India Pvt. Ltd, India

Organising Committee
  • Anil Lingambudi, IBM, India
  • Bhyrav Mutnury, Dell, India
  • GV Mahesh, Indian Institute of Science, India
  • Jairam Sukumar, Qualcomm, India
  • Y B Chethan Kumar, Texas Instrument, India
  • Anant Devi, Simyog, India
  • Hitesh Shrimali, IIT Mandi
  • Vinayak Hande, IIT Ropar
  • B K Kaushik, IIT Roorkee
  • Rajeevan Chande, NIT Hamirpur
Technical Programme Committee
  • Nikita Ambasana, Intel, India
  • Kemal Aygun, Intel, USA
  • Olivier Bayet, STMicroelectronics, France
  • Moises Cases, Cases Group, USA
  • Tom Dhaene, Ghent University, Belgium
  • Alistair Duffy, De Montfort University, UK
  • Jun Fan, Missouri ST University, USA
  • Paul Franzon, NC State University, USA
  • Dipanjan Gope, Indian Institute of Science, India
  • Flavia Grassi, Politech Milano, Italy
  • Mahesh GV, Indian Institute of Science, India
  • Mohammad S Hashmi, IIIT Delhi, India
  • Alex P James, Nazarbayev University, Kazakhstan
  • Jingook Kim, UNIST, Korea
  • Dhanesh G. Kurup, Amrita University, India
  • Sanda Lefteriu, IMT Lille, France
  • Erping Li, Zhejiang University, China
  • Kathleen L Melde, University of Arizona, USA
  • Vipul Mishra, Bennett University, India
  • SLN Murthy, ASM Technologies, India
  • Bhyrav Mutnury, DELL, USA
  • Ivan Ndip, IZM Fraunhofer, Germany
  • Antonio Orlandi, University of L’Aquila, Italy
  • Albert Ruehli, Missouri ST University, USA
  • Christian Schuster, TUHH, Germany
  • Hitesh Shrimali, IIT Mandi, India
  • Igor Stievano, Politecnico Di Torino, Italy
  • Suresh Subramanyam, Intel, India
  • Toshio Sudo, Shibaura Institute of Technology, Japan
  • Madhavan Swaminathan, GATECH, USA
  • Riccardo Trinchero, Politecnico Di Torino, Italy
  • Ruey-Beei Wu, National Taiwan University, Taiwan

International Steering/Advisory Committee
  • Ramachandra Achar, Carleton University, Canada
  • Dale Becker, IBM, USA
  • Arun Chandrasekhar, Intel, India
  • Shen-Li Fu, I-Shou University, Taiwan
  • Joungho Kim, KAIST, Korea
  • Er-Ping Li, Zhejiang University, China
  • Jun-Fa Mao, Shanghai Jiao Tong University (SJTU), China
  • Jose Schutt-Aine, University of Illinois at Urbana Champaign (UIUC), USA
  • Madhavan Swaminathan, Georgia Institute of Technology, USA
  • Toshio Sudo, Shibaura Inst. of Technology, Japan
  • Ruey-Beei Wu, National Taiwan University, Taiwan
  • Ke-Li Wu, The Chinese University of Hong Kong (CUHK), China
  • Paul Wesling, IEEE CPMT, USA
  • Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology (AIST), Japan
  • Hideki Asai, Shizuoka University, Japan
  • Flavio Canavero, Politecnico di Torino, Italy
  • Andreas C Cangellaris, University of Illinois at Urbana Champaign (UIUC), USA
  • Tzi-Dar Chiueh, National Chip Implementation Center, National Applied Research Laboratories, Taiwan
  • James Drewniak, Missouri University of Science and Technology, USA
  • Ching-Wen Hsue, National Taiwan University of Science and Technology (NTUST), Taiwan
  • Chih-Pin Hung, Advanced Semiconductor Engineering Inc., Taiwan
  • Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan
  • Ryuji Koga, Okayama University, Japan
  • John Lau, Industrial Technology Research Institute of Taiwan (ITRI), Taiwan
  • Yuan-Liang Li, Intel, Taiwan
  • Albert Ruehli, Missouri University of Science and Technology, USA
  • Wen-Yan Yin, Zhejiang University, China
  • Brian Young, Texas Instruments, USA
  • Dries Vande Ginste, Ghent University, Belgium